GB/T 41275.2-2022
ActiveProcess management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第2部分:减少锡有害影响
Application Summary AI generated
This standard specifies requirements for mitigating the harmful effects of tin (such as tin whiskers) in aerospace and defense electronic systems that use lead-free solder. It is applied during the design, manufacturing, and quality assurance of avionics equipment to ensure long-term reliability in harsh operational environments. The standard is intended for engineers and procurement professionals working on aircraft, spacecraft, and military electronic systems where tin-induced failures could compromise safety.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.