GB/Z 41275.22-2023

Active

Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22: Technical guidelines

航空电子过程管理 含无铅焊料航空航天及国防电子系统 第22部分:技术指南

Standard Type
GBZ
ICS
49.025.01
CCS
V25
Status
Active
Issue Date
2023-12-28
Implementation
N/A
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard provides technical guidelines for managing the use of lead-free solder in aerospace and defense electronic systems, addressing reliability and process control concerns specific to these high-stakes environments. It is applied by manufacturers and maintenance organizations in the aviation and defense industries to ensure that electronic assemblies meet stringent performance and safety requirements when transitioning from traditional tin-lead solders. The standard supports procurement, design, and production testing contexts where long-term durability under extreme conditions is critical.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.