GB/Z 41275.23-2023

Active

Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分:无铅及混装电子产品返工/修复指南

Standard Type
GBZ
ICS
49.025.01
CCS
V25
Status
Active
Issue Date
2023-12-28
Implementation
N/A
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard provides specific technical guidance for reworking and repairing electronic assemblies that use lead-free solder or mixed leaded/lead-free solder joints in aerospace and defense systems. It is applied by maintenance and manufacturing engineers working on avionics equipment to ensure reliability and compliance when repairing circuit boards or components that deviate from traditional tin-lead soldering processes. The standard addresses the unique challenges of thermal stress, joint integrity, and contamination control in high-reliability aircraft and defense electronics.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.