GB/Z 41275.4-2023
ActiveProcess management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array（BGA）re-balling
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球
Application Summary AI generated
This standard specifies technical requirements and procedures for re-balling ball grid array (BGA) components in aerospace and defense electronic systems that use lead-free solder. It is applied during maintenance, repair, or rework of avionics equipment to ensure reliable solder joint integrity and compliance with stringent aerospace quality and reliability standards. The standard is intended for use by engineers and procurement professionals involved in the lifecycle management of electronic assemblies for aircraft and defense systems.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.