GB/T 19290.7-2021

Active

Modular order for the development of mechanical structures for electronic equipment practices—Part 2-5: Sectional specification—Interface co-ordination dimensions for the 25 mm equipment practice—Cabinet interface dimensions for miscellaneous equipment

发展中的电子设备构体机械结构模数序列　第2-5部分：分规范　25 mm设备构体的接口协调尺寸　各种设备用机柜接口尺寸

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Active
Issue Date
2021-10-11
Implementation
2022-05-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies the interface coordination dimensions for cabinets used with miscellaneous electronic equipment within the 25 mm modular equipment practice. It is applied in the design and manufacturing of mechanical structures for electronic systems, ensuring physical interoperability and compatibility between cabinets and various plug-in units or subracks. The standard is primarily used by engineers and procurement professionals in the electronics industry to define mounting, alignment, and connection interfaces for equipment enclosures.

Related Standards

GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19405.2-2003 Surface mounting technology--Part 2:Transportation and storage conditions of surface mounting devices(SMD)--Application guide
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.