GB/T 19247.1-2003

Active

Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求

Standard Type
GBT
ICS
31.240
CCS
L94
Status
Active
Issue Date
2003-07-02
Implementation
2003-10-01
Centralized Committee
工业和信息化部（电子）
Issuing Authority
中华人民共和国国家质量监督检验检疫总局

Application Summary AI generated

This standard specifies the general performance and quality requirements for soldered electrical and electronic assemblies that utilize surface mount technology (SMT) and related assembly methods. It is applied in the manufacturing and inspection of printed board assemblies (PCBs) across the electronics industry, serving as a benchmark for acceptance testing and process control. The standard ensures reliability and consistency in soldered connections for consumer electronics, telecommunications, and industrial control equipment.

Related Standards

GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19405.2-2003 Surface mounting technology--Part 2:Transportation and storage conditions of surface mounting devices(SMD)--Application guide GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.