GB/T 19405.2-2003

Active

Surface mounting technology--Part 2:Transportation and storage conditions of surface mounting devices(SMD)--Application guide

表面安装技术第2部分:表面安装元器件的运输和贮存条件应用指南

Standard Type

GBT

ICS

31.240

CCS

L94

Status

Active

Issue Date

2003-11-24

Implementation

2004-08-01

Centralized Committee

工业和信息化部（电子）

Issuing Authority

中华人民共和国国家质量监督检验检疫总局

Application Summary AI generated

This standard provides application guidelines for the proper transportation and storage conditions of surface mounting devices (SMDs) to prevent damage from moisture, mechanical stress, and electrostatic discharge. It is applied in the electronics manufacturing industry, specifically during the logistics and warehousing phases of SMD procurement and assembly. The guide helps engineers and procurement professionals ensure component reliability before reflow soldering in printed circuit board (PCB) assembly processes.

Related Standards

GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.