GB/T 19247.3-2003

Active

Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies

印制板组装 第3部分:分规范 通孔安装焊接组装的要求

Standard Type
GBT
ICS
31.240
CCS
L94
Status
Active
Issue Date
2003-11-24
Implementation
2004-08-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
中华人民共和国国家质量监督检验检疫总局

Application Summary AI generated

This standard specifies the requirements for through-hole mount soldered assemblies used in printed board assemblies. It is applied in the electronics industry for quality control and acceptance testing of solder joints in through-hole components, ensuring mechanical and electrical reliability. The standard is relevant for manufacturers, inspectors, and procurement professionals dealing with electronic assemblies in sectors like consumer electronics, telecommunications, and industrial equipment.

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.