GB/T 18663.5-2022

Active

Mechanical structures for electronic equipment—Tests for metric and inch system—Part 5: Seismic tests for chassis, subracks and plug-in units

电子设备机械结构 公制系列和英制系列的试验 第5部分：机箱、插箱和插件的地震试验

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Active
Issue Date
2022-10-14
Implementation
2023-05-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies seismic testing methods for chassis, subracks, and plug-in units used in electronic equipment, covering both metric and inch system configurations. It is applied in industries such as telecommunications, data centers, and industrial control to verify that electronic enclosures and their mounted components can withstand earthquake-induced vibrations without structural failure or functional disruption. The tests ensure equipment reliability in seismically active regions, guiding design validation and procurement specifications for rack-mounted electronic systems.

Related Standards

GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19405.2-2003 Surface mounting technology--Part 2:Transportation and storage conditions of surface mounting devices(SMD)--Application guide GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.