Browse Standards

发光二极管芯片点测方法

Probe test method for light emitting diode chips

纳米钛酸钡

Nanoscale barium titanate

半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

掺钕钇铝石榴石激光棒激光阈值及斜率效率测量方法

Test method for lasing threshold and slope efficiency of Nd:YAG laser rods

偏置电场下材料热释电系数测试方法

Test method for pyroelectric coefficient of materials under DC bias field

低压机柜 抽出式功能单元机械结构

Cabinets for low-voltage switchgear—Mechanical structures for drawout functional unit

低压机柜 电气机械结构

Cabinets for low-voltage switchgear—Electrical mechanical structures

绝缘机箱的安全要求

Safety requirements for insulated chassis

普通混合液晶材料规范

Specification for common mixture liquid crystal materials

半导体照明术语

Semiconductor lighting terminology

光伏组件用乙烯—醋酸乙烯共聚物交联度测试方法 差示扫描量热法

Test method for cross-linking degree of ethylene-vinyl acetate copolymer applied in photovoltaic modules—Differential scanning calorimetry（DSC）

平板显示器（FPD）偏光膜表面耐划伤性的测试方法

Test method for surface scratch resistance of flat panel display（FPD）polarizing film

平板显示器(FPD)彩色滤光片测试方法 第5部分：对比度

Test method of flat panel display (FPD) color filters—Part 5: Contrast ratio

光伏组件封装用乙烯-醋酸乙烯酯共聚物(EVA)胶膜

Ethylene-vinyl acetate copolymer (EVA) film for PV module

电子设备机械结构 482.6 mm(19 in)系列机械结构尺寸 第3-106部分:适用于符合IEC 60917-2-1公制机柜或机架的插箱和机箱的适配尺寸

Mechanical structures for electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1

发展中的电子设备构体机械结构模数序列 第2-4部分:分规范 25 mm设备构体的接口协调尺寸 适用于符合IEC 60297-3-100(19 in)机柜或机架的插箱或机箱的适配尺寸

Modular order for the development of mechanical structures for electronic equipment practices—Part 2-4: Sectional specification—Interface co-ordination dimensions for the 25 mm equipment practice—Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 602

半导体器件 集成电路 第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)

Semiconductor devices—Integrated circuits—Part 21-1：Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures

半导体器件 集成电路 第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)

Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures

有机发光二极管照明 术语和文字符号

Organic light-emitting diode （OLED）lighting—Terminology and letter symbols

单、双面挠性印制板分规范

Sectional specification for single and double sided flexible printed board