GB/T 15879.5-2018
ActiveMechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值
Application Summary AI generated
This standard specifies the mechanical dimensions, tolerances, and interface requirements for tape automated bonding (TAB) of integrated circuits. It is applied in the semiconductor packaging and assembly industry to ensure compatibility between TAB tape, bonding tools, and IC chips during high-volume automated manufacturing. The standard facilitates reliable electrical connections and mechanical alignment in applications such as consumer electronics, automotive systems, and telecommunications equipment.
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