Browse Standards

半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性

Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics

标称电压1 kV及以下交流电力系统用自愈式并联电容器 第1部分:总则----性能、试验和定额----安全要求----安装和运行导则

Shunt power capacitors of the self-healing type for a.c. systems having a rated valtage up to and including 1000V--Part 1:General--Performance，testing and rating--Safety requirements--Guide for installation and operation

感应加热装置用电力电容器 第1部分:总则

Power capacitors for inductionheating installations--Part 1:General

电力半导体器件用散热器 第1部分:铸造类系列

Heat sink for power semiconductor device--Part 1:Casting kind series

电力半导体器件用散热器 第2部分:热阻和流阻测试方法

Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference

电力半导体器件用散热器 第3部分:绝缘件和紧固件

Heat sink for power semiconductor device--Part 3:Insulators and fasteners

标称电压1 kV及以下交流电力系统用自愈式并联电容器 第2部分:老化试验、自愈性试验和破坏试验

Shunt power capacitors of the self-healing type for a.c.systems having a rated voltage up to and including 1000V--Part 2:Ageing test，self-healing test and destruction test

感应加热装置用电力电容器 第2部分:老化试验、破坏试验和内部熔丝隔离要求

Power capacitors for induction heating installations--Part 2:Ageing test，destruction test and requirements for disconnecting internal fuses

电子设备用机电开关 第4-1部分:钮子(倒扳)开关 空白详细规范

Electromechanical switches for use in electronic equipment Part 4-1:Sectional specification for lever(toggle)switches Blank detail specification

半导体器件 分立器件 电流大于 100A、环境和管壳额定的双向三极晶闸管空白详细规范

Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A

半导体器件 分立器件 第6部分:晶闸管 第3篇 电流大于 100A、环境和管壳额定的反向阻断三极晶闸管空白详细规范

Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A

激光加工机械 金属切割的性能规范与标准检查程序

Laser processing machines--Performance specifications and benchmarks for cutting of metals

集成电路TSV三维封装可靠性试验方法指南

Integrated circuit TSV 3D package reliability test methods guideline

半导体器件 基于扫描的半导体器件退化水平评估

Semiconductor devices—Scan based ageing level estimation for semiconductor devices

半导体器件 分立器件 第17部分：基本绝缘和加强绝缘的磁耦合器和电容耦合器

Semiconductor devices—Discrete devices—Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

封装引线电阻测试方法

Test method for measuring the resistance of package leads

电子设备机械结构 户外机壳 第1部分:设计导则

Mechanical structures for electronic equipment--Outdoor enclosures--Part 1: Design guidelines

电力系统二次回路控制、保护屏及柜基本尺寸系列

Series of basic dimensionof control and protective panels and cabinet for secondary circuit of power system

电子设备机械结构 户外机壳 第2-2部分: 箱体尺寸

Mechanical structuresfor electronic equipment--Outdoor enclosures--Part 2-2: Dimensions for cases

电子设备机械结构 户外机壳 第2-1部分:机柜尺寸

Mechanical structuresfor electronic equipment--Outdoor enclosures--Part 2-1:Dimensions for cabinets