GB/T 7423.3-1987
ActiveHeat sink of semiconductor devices--Heat sink， staggered fingers shapes
半导体器件散热器 叉指形散热器
Application Summary AI generated
This standard specifies the dimensions, technical requirements, and testing methods for staggered finger-shaped heat sinks used to dissipate heat from semiconductor devices. It is applied in the design and manufacturing of electronic equipment, such as power supplies and amplifiers, where these heat sinks are mounted onto transistors or integrated circuits to ensure thermal management and reliable operation.
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