GB/T 7423.2-1987

Active

Heat sink of semiconductor devices--Heat sink，extruded shapes

半导体器件散热器 型材散热器

Standard Type
GBT
ICS
31.240
CCS
L32
Status
Active
Issue Date
1987-03-16
Implementation
1987-11-01
Centralized Committee
工业和信息化部（电子）
Issuing Authority
国家标准局

Application Summary AI generated

This standard specifies the dimensions, technical requirements, and test methods for extruded aluminum heat sinks used with semiconductor devices. It is applied in the design and manufacturing of electronic equipment where forced or natural convection cooling is required to manage thermal dissipation from components like power transistors and diodes. The standard ensures compatibility and performance consistency across different manufacturers' extruded heat sink profiles.

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.