GB/T 7423.1-1987
ActiveHeat sink of semiconductor devices--Generic specification
半导体器件散热器 通用技术条件
Application Summary AI generated
This standard specifies the general technical requirements, test methods, and acceptance rules for heat sinks used with semiconductor devices. It is applied in the design, manufacturing, and quality inspection of heat sinks for power transistors, diodes, and other electronic components to ensure adequate thermal management. The standard is relevant across electronics industries, including consumer electronics, industrial equipment, and power supply systems.
Related Standards
GB/T 19247.2-2003
Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies
GB/T 19247.1-2003
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
GB/T 3047.5-2003
Series of basic dimensions of cabiners for vertical increment of 20mm
GB/T 3047.3-2003
Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm
GB/T 19290.1-2003
Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard
GB/T 19290.2-2003
Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice
GB/T 19247.3-2003
Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
GB/T 19247.4-2003
Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.