GB/T 4937.4-2012
ActiveSemiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
半导体器件 机械和气候试验方法 第4部分：强加速稳态湿热试验（HAST）
Application Summary AI generated
This standard specifies the highly accelerated stress test (HAST) method for evaluating the moisture resistance of semiconductor devices under conditions of high temperature, high humidity, and pressure. It is applied in the electronics industry to assess the reliability and susceptibility to corrosion or delamination of plastic-encapsulated integrated circuits and discrete components. The test is typically used during product qualification, process monitoring, or failure analysis to simulate long-term humid environment exposure in a shortened timeframe.
Related Standards
GB/T 8446.1-2004
Heat sink for power semiconductor device--Part 1:Casting kind series
GB/T 8446.3-2004
Heat sink for power semiconductor device--Part 3:Insulators and fasteners
GB/T 8446.2-2004
Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference
GB/T 13150-2005
Semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A
GB/T 13151-2005
Semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A
GB/Z 107-2025
Semiconductor devices—Scan based ageing level estimation for semiconductor devices
GB/Z 102.17-2026
Semiconductor devices—Discrete devices—Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
GB/T 6589-2002
Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.