GB/T 4937.39-2025
UpcomingSemiconductor devices—Mechanical and climatic test methods—Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
半导体器件 机械和气候试验方法 第39部分：半导体器件用有机材料的潮气扩散率和水溶解度测量
Application Summary AI generated
This standard specifies test methods for measuring moisture diffusivity and water solubility in organic materials used in semiconductor components. It is applied in the electronics industry to evaluate and qualify encapsulation compounds, adhesives, and underfill materials for reliability testing, particularly in moisture-sensitive device packaging and qualification processes.
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