GB/T 4937.37-2025
UpcomingSemiconductor devices—Mechanical and climatic test methods—Part 37: Board level drop test method using an accelerometer
半导体器件 机械和气候试验方法 第37部分：采用加速度计的板级跌落试验方法
Application Summary AI generated
This standard specifies a board-level drop test method for semiconductor devices using an accelerometer to measure mechanical shock during free fall. It is applied in the electronics industry to evaluate the solder joint reliability and structural integrity of components mounted on printed circuit boards (PCBs) under accidental drop conditions, particularly for portable electronic products like smartphones and tablets.
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