GB/T 4937.35-2024
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components
半导体器件 机械和气候试验方法 第35部分：塑封电子元器件的声学显微镜检查
Application Summary AI generated
This standard specifies the use of acoustic microscopy for non-destructive internal inspection of plastic encapsulated semiconductor devices. It is applied in the electronics industry to detect defects such as delamination, cracks, and voids within the plastic packaging of integrated circuits and discrete components. The method is primarily used during manufacturing quality control, reliability testing, and failure analysis to ensure structural integrity.
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