GB/T 4937.31-2023
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）
半导体器件 机械和气候试验方法 第31部分：塑封器件的易燃性（内部引起的）
Application Summary AI generated
This standard specifies a test method for evaluating the flammability of plastic-encapsulated semiconductor devices when ignition is caused by internal electrical faults or overheating. It is applied in the electronics industry to assess the fire safety risk of components like integrated circuits and transistors under abnormal operating conditions. The test is critical for quality assurance and safety certification of encapsulated devices used in consumer electronics, automotive systems, and industrial equipment.
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