GB/T 4937.30-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理
Application Summary AI generated
This standard specifies the preconditioning procedures, including temperature cycling, baking, moisture soaking, and reflow soldering, that must be applied to non-hermetic surface mount semiconductor devices before they undergo reliability testing. It is used in the electronics industry to simulate the stresses these components experience during assembly, ensuring that subsequent reliability tests accurately reflect the device's performance after exposure to real-world manufacturing processes.
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