GB/T 4937.29-2025
UpcomingSemiconductor devices—Mechanical and climatic test methods—Part 29: Latch-up test
半导体器件 机械和气候试验方法 第29部分：闩锁试验
Application Summary AI generated
This standard specifies the test method for evaluating the susceptibility of semiconductor devices to latch-up, a condition where a parasitic structure causes a low-impedance path leading to functional failure or damage. It is applied during the qualification and reliability testing of integrated circuits, particularly CMOS devices, used in automotive, industrial, and consumer electronics to ensure stable operation under specified current and voltage stress conditions.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.