GB/T 4937.22-2018

Active

Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength

半导体器件 机械和气候试验方法 第22部分：键合强度

Standard Type
GBT
ICS
31.080.01
CCS
L40
Status
Active
Issue Date
2018-09-17
Implementation
2019-01-01
Centralized Committee
工业和信息化部（电子）
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies test methods for measuring the bond strength of wire bonds, ribbon bonds, and die attachments in semiconductor devices. It is applied in the manufacturing and quality control of integrated circuits, diodes, transistors, and other discrete semiconductor components to ensure mechanical reliability. The tests are critical for evaluating assembly integrity under mechanical stress, thermal cycling, and other environmental conditions in electronics production and reliability testing.

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.