GB/T 4937.201-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
Application Summary AI generated
This standard specifies the procedures for handling, packing, labelling, and shipping surface-mount semiconductor devices that are sensitive to moisture and soldering heat. It is applied in the electronics manufacturing industry to prevent moisture-induced damage during reflow soldering, ensuring device reliability throughout storage and transport.
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