GB/T 4937.20-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响
Application Summary AI generated
This standard specifies the test method for evaluating the resistance of plastic-encapsulated surface-mount devices (SMDs) to the combined effects of moisture absorption and soldering heat. It is applied in the electronics industry to qualify semiconductor components for assembly processes, ensuring they can withstand reflow soldering without internal damage or delamination after exposure to humid environments.
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