GB/T 4937.2-2006
ActiveSemiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure
半导体器件 机械和气候试验方法 第2部分:低气压
Application Summary AI generated
This standard specifies test methods for evaluating the ability of semiconductor devices to withstand, store, or operate under low air pressure conditions, simulating high-altitude or unpressurized environments. It is applied in the aerospace, aviation, and high-altitude electronics industries to qualify components for use in aircraft, satellites, and other equipment exposed to reduced atmospheric pressure. The testing ensures device reliability by assessing risks such as corona discharge, arcing, or mechanical failure due to pressure differentials.
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