GB/T 4937.19-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
半导体器件 机械和气候试验方法 第19部分：芯片剪切强度
Application Summary AI generated
This standard specifies the test method for determining the shear strength of die attachments in semiconductor devices. It is applied in the manufacturing and quality control of integrated circuits and discrete semiconductors to verify the mechanical integrity of chip-to-substrate bonds. The test is critical for ensuring device reliability under mechanical stress in automotive, aerospace, and industrial electronics.
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