GB/T 4937.15-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热
Application Summary AI generated
This standard specifies the test method for evaluating the ability of through-hole mounted semiconductor devices to withstand the thermal stress of soldering. It is applied in the electronics industry during manufacturing and quality assurance to ensure that components like diodes and transistors are not damaged by the heat of wave soldering or hand soldering processes.
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