GB/T 4937.14-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）
半导体器件 机械和气候试验方法 第14部分：引出端强度（引线牢固性）
Application Summary AI generated
This standard specifies test methods for evaluating the mechanical strength and integrity of semiconductor device leads and terminations, including tensile, bending, and torque tests. It is applied in the electronics industry for quality assurance and reliability testing of discrete semiconductor devices and integrated circuits, particularly during product qualification and incoming inspection. The standard ensures that leads can withstand assembly, handling, and operational stresses without failure.
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