GB/T 4937.11-2018
ActiveSemiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法
Application Summary AI generated
This standard specifies the two-fluid-bath method for testing the ability of semiconductor devices to withstand rapid temperature changes. It is applied in the electronics industry to evaluate the mechanical and climatic reliability of components like integrated circuits and diodes by alternately immersing them in hot and cold liquid baths. The test is critical for quality assurance in manufacturing and qualification processes, particularly for devices used in automotive, aerospace, or industrial environments where sudden thermal shocks occur.
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