GB/T 46381-2025
ActiveLow radioactive spherical silica powder for integrated circuit packaging
集成电路封装用低放射性球形氧化硅微粉
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging for low radioactive spherical silica powder used in integrated circuit packaging. It is applied in the semiconductor industry to ensure the material's purity and low radioactivity levels, which are critical for preventing soft errors in advanced chip packaging processes. The standard is particularly relevant for manufacturers and users of epoxy molding compounds and underfill materials in high-reliability electronic devices.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.