GB/T 46378-2025
ActiveSpherical alumina powder for integrated circuit packaging
集成电路封装用球形氧化铝微粉
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging/storage conditions for spherical alumina powder used in integrated circuit packaging. It is applied in the semiconductor industry for materials used in epoxy molding compounds and thermal interface materials to ensure proper heat dissipation and reliability in chip packaging. The standard is relevant for manufacturers and quality control testing of fillers in advanced electronic packaging applications.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.