GB/T 45722-2025

Active

Semiconductor devices—Constant current electromigration test

半导体器件 恒流电迁移试验

Standard Type
GBT
ICS
31.080.01
CCS
L40
Status
Active
Issue Date
2025-05-30
Implementation
2025-09-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies the test method for evaluating the electromigration resistance of metal interconnects in semiconductor devices under constant current stress. It is applied in the reliability testing and qualification of integrated circuits and discrete semiconductor components, particularly for assessing the long-term failure risk of aluminum or copper interconnect lines in microelectronic manufacturing. The standard is used by semiconductor fabs, testing laboratories, and quality assurance teams to ensure device robustness against current-induced material migration.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.