GB/T 44517-2024
ActiveMicro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
微机电系统（MEMS）技术 MEMS膜残余应力的晶圆曲率和悬臂梁挠度试验方法
Application Summary AI generated
This standard specifies test methods for determining residual stresses in MEMS thin films by measuring wafer curvature or cantilever beam deflection. It is applied in semiconductor fabrication and MEMS device manufacturing to evaluate film stress levels, ensuring reliability and performance in microsensors, actuators, and other microsystem components. Engineers use these methods during process development and quality control to prevent film cracking, delamination, or device failure.
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