GB/T 44514-2024
ActiveMicro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials
微机电系统（MEMS）技术 层状MEMS材料界面黏附能四点弯曲试验方法
Application Summary AI generated
This standard specifies a four-point bending test method to measure the interfacial adhesion energy between layers in micro-electromechanical systems (MEMS) materials. It is applied in the design, reliability assessment, and quality control of layered MEMS devices, such as sensors, actuators, and micro-mirrors, where delamination at material interfaces can cause device failure. The method is used by engineers and manufacturers in the semiconductor and microelectronics industries to evaluate and ensure the mechanical integrity of multi-layer thin-film structures.
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