GB/T 42706.5-2023

Active

Electronic components—Long-term storage of electronic semiconductor devices—Part 5：Die and wafer devices

电子元器件 半导体器件长期贮存 第5部分：芯片和晶圆

Standard Type
GBT
ICS
31.080
CCS
L40
Status
Active
Issue Date
2023-05-23
Implementation
2023-09-01
Centralized Committee
工业和信息化部（电子）
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies storage conditions, packaging requirements, and periodic inspection procedures to prevent degradation of semiconductor die and wafer devices during long-term storage. It is applied in electronics manufacturing and supply chain management, particularly for inventory management of bare chips and wafers used in integrated circuit assembly and semiconductor fabrication facilities.

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.