GB/T 4194-2017
ActiveCreep testing, high temperature treatment and metallographic examination of the tungsten wire
钨丝蠕变试验、高温处理及金相检查方法
Application Summary AI generated
This standard specifies the methods for creep testing, high-temperature treatment, and metallographic examination of tungsten wire. It is applied in the electronics industry for quality control and performance evaluation of tungsten wire used in products like incandescent lamp filaments, vacuum tube cathodes, and other electronic components that operate under high thermal and mechanical stress. The standard ensures consistent material behavior and reliability in high-temperature applications.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.