GB/T 41853-2022
ActiveSemiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
半导体器件 微机电器件 晶圆间键合强度测量
Application Summary AI generated
This standard specifies the methods for measuring the bonding strength between wafers in micro-electromechanical systems (MEMS) manufacturing. It is applied in the semiconductor industry to ensure the reliability and quality of wafer-level packaging and 3D integration processes. The standard provides testing protocols for evaluating adhesion at bonded interfaces, critical for device performance in sensors, actuators, and other MEMS products.
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