GB/T 41852-2022

Active

Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法

Standard Type
GBT
ICS
31.080.99
CCS
L55
Status
Active
Issue Date
2022-10-12
Implementation
2022-10-12
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies bend and shear test methods for measuring the adhesive strength of MEMS structures, providing quantitative evaluation of bonding quality between layers or components. It is applied in the semiconductor and microelectronics industries for quality control and reliability testing of MEMS devices, such as accelerometers, pressure sensors, and micro-mirrors, during design validation or manufacturing.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.