GB/T 40815.2-2021

Active

Mechanical structures for electrical and electronic equipment—Thermal management for cabinets in accordance with inch and metric system—Part 2: Method for the determination of forced air cooling

电气和电子设备机械结构　符合英制系列和公制系列机柜的热管理　第2部分：强迫风冷的确定方法

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Active
Issue Date
2021-10-11
Implementation
2022-05-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies a method for determining the forced air cooling requirements of cabinets used for electrical and electronic equipment, accommodating both inch and metric system dimensions. It is applied in the design and testing of enclosures for telecommunications, data centers, and industrial control systems to ensure adequate thermal management. Engineers use it to calculate airflow and fan specifications needed to maintain safe operating temperatures within the cabinet.

Related Standards

GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.