GB/T 40564-2021
ActiveTest method of epoxy molding compound for electronic packaging
电子封装用环氧塑封料测试方法
Application Summary AI generated
This standard specifies the test methods for key properties of epoxy molding compounds used in electronic packaging, including flowability, curing characteristics, thermal stability, and mechanical strength. It is applied in the semiconductor and electronics industries for quality control and material selection during the manufacturing of encapsulated integrated circuits, discrete devices, and other microelectronic components. The standard ensures consistent performance and reliability of packaging materials in production and testing environments.
Related Standards
GB/T 15871-1995
Hard surface photomask substrates
GB/T 15870-1995
Chrome thin films for hard surface photomasks
GB/T 15750-2008
Test methods for the properties of piezoelectric ceramics - Test for the ageing properties
GB/T 9505-2010
Barium flash getters
GB/T 6149-2010
New constantan resistance alloy
GB/T 6145-2010
Manganin and constantan alloy wires,sheet and rolled wires for precision electrical resistance
GB/T 25497-2010
Test methods for gas absorbency and release of getters
GB/T 25496-2010
Test methods for the mechanical properties of getters
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.