GB/T 34983-2017
ActiveResin bond diamond wire for photovoltaic applications
光伏用树脂金刚石切割线
Application Summary AI generated
GB/T 34983-2017 specifies the technical requirements, test methods, inspection rules, and packaging for resin bond diamond wire used in slicing photovoltaic silicon wafers. It is applied in the manufacturing of solar cells, where the wire is used in multi-wire sawing machines to cut monocrystalline and polycrystalline silicon ingots into thin wafers with minimal kerf loss and surface damage. This standard ensures consistent wire diameter, diamond particle distribution, and cutting performance for high-efficiency photovoltaic production.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.