GB/T 32999-2016
ActiveSurface chemical analysis—Depth profiling—Measurement of sputtering rate: mesh-replica method using a mechanical stylus profilometer
表面化学分析 深度剖析 用机械轮廓仪栅网复型法测量溅射速率
Application Summary AI generated
This standard specifies a method for measuring the sputtering rate during depth profiling in surface chemical analysis. It is applied in materials science and semiconductor industries to calibrate the removal rate of material layers during ion sputtering, using a mesh-replica technique combined with a mechanical stylus profilometer. The method ensures accurate depth scale calibration for techniques like Auger electron spectroscopy (AES) or X-ray photoelectron spectroscopy (XPS) when analyzing thin films or layered structures.
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