GB/T 29847-2025
ActiveTest methods for copper foil used for printed boards
印制板用铜箔测试方法
Application Summary AI generated
This standard specifies the test methods for copper foil used in the production of printed circuit boards (PCBs), covering parameters such as thickness, tensile strength, elongation, and surface roughness. It is applied in the electronics manufacturing industry, particularly by PCB fabricators and copper foil suppliers, to ensure material quality and consistency during incoming inspection and process control. The standard is also used in laboratory testing contexts to verify compliance with product specifications for rigid and flexible printed boards.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.