GB/T 29847-2013
AbolishedTest methods for copper foil used for printed boards
印制板用铜箔试验方法
Application Summary AI generated
This standard specifies test methods for evaluating the physical, mechanical, and electrical properties of copper foil used in the manufacture of printed circuit boards (PCBs). It is applied by PCB manufacturers and material suppliers in the electronics industry to ensure copper foil meets requirements for thickness, tensile strength, peel strength, and surface roughness, directly impacting the reliability of electronic assemblies in consumer electronics, telecommunications, and automotive systems.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.