GB/T 29846-2025
ActivePhotoimageable plating and etching resist for printed circuit board
印制板用光成像耐电镀抗蚀剂
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging conditions for photoimageable plating and etching resists used in the manufacture of printed circuit boards (PCBs). It is applied in the electronics industry, specifically during PCB fabrication processes where the resist is used to define conductive patterns for electroplating or etching. The standard ensures consistent performance in terms of resolution, adhesion, chemical resistance, and process compatibility for high-density interconnect and multilayer boards.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.