GB/T 23360-2009
ActiveMethod of evaluating the thermal performance of enclosures
机壳热特性的估算方法
Application Summary AI generated
This standard specifies a method for evaluating the thermal performance of electronic enclosures, focusing on how heat dissipates from the casing to the surrounding environment. It is applied in the design and testing of electronic equipment housings, such as those for computers, power supplies, and telecommunications devices, to ensure adequate cooling and prevent overheating. The method helps engineers compare enclosure designs and predict thermal behavior under specified conditions.
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