GB/T 19520.21-2023

Active

Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109: Dimensions of chassis for embedded computing devices

电气和电子设备机械结构 482.6 mm(19 in)系列机械结构尺寸 第3-109部分：嵌入式计算设备的机箱尺寸

Standard Type
GBT
ICS
31.240
CCS
K 05
Status
Active
Issue Date
2023-11-27
Implementation
2024-06-01
Centralized Committee
国家标准委
Issuing Authority
国家市场监督管理总局 国家标准化管理委员会

Application Summary AI generated

This standard specifies the mechanical dimensions for chassis designed to house embedded computing devices within the 482.6 mm (19-inch) rack system. It is applied in the design and manufacturing of industrial electronics, telecommunications equipment, and data centers to ensure physical compatibility and interchangeability of embedded computing hardware. The standard facilitates consistent integration of computing modules into standardized rack enclosures, supporting efficient thermal management and cable routing.

Related Standards

GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.