GB/T 19520.1-2007

Abolished

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6mm(19in) series - Part 1: Panels and racks

电子设备机械结构 482.6mm(19in)系列机械结构尺寸 第1部分：面板和机架

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Abolished
Issue Date
2007-01-23
Implementation
2007-08-01
Centralized Committee
国家标准委
Issuing Authority
国家标准委

Application Summary AI generated

This standard specifies the dimensions and interface requirements for panels and racks used in the 482.6mm (19-inch) series mechanical structures for electronic equipment. It is applied in the design and manufacturing of enclosures for telecommunications, data processing, and industrial control systems to ensure interoperability and compatibility between different manufacturers' components. The standard is critical for engineers and procurement professionals when specifying or sourcing standardized rack-mount panels and chassis for electronic assemblies.

Related Standards

GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.