GB/T 19290.4-2009

Active

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subrack, chassis, backplanes, front panels and plug

发展中的电子设备构体机械结构模数序列 第2-2部分：分规范 25mm设备构体的接口协调尺寸 详细规范 插箱、机箱、背板、面板和插件的尺寸

Standard Type
GBT
ICS
31.240
CCS
K05
Status
Active
Issue Date
2009-03-19
Implementation
2009-12-01
Centralized Committee
国家标准委
Issuing Authority
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies the detailed interface coordination dimensions for subracks, chassis, backplanes, front panels, and plug-in units within the 25 mm modular equipment practice. It is applied in the design and manufacturing of electronic equipment mechanical structures to ensure mechanical interchangeability and compatibility between components from different suppliers. The standard is primarily used in the telecommunications, industrial control, and data processing industries for rack-mounted electronic systems.

Related Standards

GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies GB/T 3047.5-2003 Series of basic dimensions of cabiners for vertical increment of 20mm GB/T 19290.1-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 1: Generic standard GB/T 19290.2-2003 Modular order for the development of mechanical structures for electronic equipment practices--Part 2: Sectional specification--Interface co-ordination dimensions for the 25mm equipment practice GB/T 3047.3-2003 Series of basic dimensions of subracks and plug-in units for vertical increment of 20mm GB/T 19405.1-2003 Surface mounting technology--Part 1:Standard method for the specification of surface mounting components(SMDs) GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.